Latest Footprint Expert version is highly recommended as POD data format is periodically updated to accommodate new Footprint Expert features. PLUS all the features of the FREE Footprint Expert "Pro" edition, which include: ** New part requests start at $5, per pricing schedule posted on POD credits page. Calculate high resolution footprints directly from component dimensions.Enter component dimensions using Nominal plus tolerance or Min/Max dimensions.Automate creation of component manufacturer recommended footprints.One-click rotate/mirror footprint, very useful for rapid LGA/BGA design wow!!.One-click pad shapes supported: Rectangle, Oblong, D-Shape, and Rounded Rectangle.Dynamic support for Imperial and metric - easily convert between mil and metric units.
Apply rules to component families and component terminal lead types.(licensed outputs in the Enterprise Edition are purchased options, not free features) We built the Footprint Expert around the notion that there are as many unique PCB library needs as there are users. If you consider tolerance settings, units, line-widths, pad shapes, rotations, and many dozens of other settings (all configurable with the PCB Footprint Expert), you can create over 1,800 variations of ONE SINGLE library! We empower you to quickly build high-quality standard libraries to meet your specific needs.ġIPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices. The geometry furnished for these devices, as well as inward and "J" - formed lead contact device families, may provide a wider process window for reflow solder processes as well.ĢIPC B: Median (Nominal) Land Protrusion – Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow soldering of leadless chip and leaded Gull Wing type devices.ģIPC C: Minimum (Least) Land Protrusion – High component density typical of portable and hand-held product applications may consider the 'minimum' land pattern geometry variation. Selection of the minimum land pattern geometry may not be suitable for all product use categories.
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